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Improved Channel Mobility in 4H-SiC MOSFETs by Boron Passivation
124
Citations
19
References
2014
Year
SemiconductorsB AtomsElectrical EngineeringSemiconductor TechnologyEngineeringBoron PassivationNanoelectronicsApplied PhysicsHigh Channel MobilityChannel MobilityPower Semiconductor DeviceSemiconductor Device FabricationPower SemiconductorsPower ElectronicsCarbideSemiconductor Device
We propose another process for fabricating 4H-SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) with high channel mobility. The B atoms were introduced into a SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> /4H-SiC interface by thermal annealing with a BN planar diffusion source. The interface state density near the conduction band edge of 4H-SiC was effectively reduced by the B diffusion and the fabricated 4H-SiC MOSFETs showed a peak field-effect mobility of 102 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /Vs. The obtained high channel mobility cannot be explained by counter doping because B atoms act as acceptors in 4H-SiC. We suggest that the interfacial structural change of SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> may be responsible for the reduced trap density and enhanced channel mobility.
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