IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 80 citations · 6 references
EngineeringElectrical EngineeringCircuit TheoryMicroelectronicsSemiconductor DevicesCmos Circuit DesignDevice ModelingDevice SimulationIntegrated Circuit DesignNoise In Electronic DevicesNoise In Semiconductor DevicesCircuit SimulationComplementary Metal-oxide-semiconductor DevicesIntegrated Passive ComponentsNoise AnalysisNoise Analysis In Integrated CircuitsNoise In Integrated CircuitsPower DistributionSimultaneous Switching Noise
The computer package designer depends on modeling power supply noises to ensure that system designs will function properly. Power supply noises can have a tremendous effect on system operation and performance. The circuit simulation of a system power distribution is very challenging since it requires accurate models of active devices, passive components, transmission lines, and a very large power distribution network. This paper presents the development of a high-frequency power distribution model for the simulation of simultaneous switching noise of a complementary metal-oxide-semiconductor (CMOS) chip on a multilayered ceramic substrate. Measurements are performed on a CMOS chip with simultaneously switching off-chip drivers (OCD's). The modeling approach is validated by the excellent agreement between the measurement waveforms and simulation results.
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