Modeling, measurement, and simulation of simultaneous switching noise

B.D. McCredie, Dale Becker

IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 80 citations · 6 references

Concepts

Abstract

The computer package designer depends on modeling power supply noises to ensure that system designs will function properly. Power supply noises can have a tremendous effect on system operation and performance. The circuit simulation of a system power distribution is very challenging since it requires accurate models of active devices, passive components, transmission lines, and a very large power distribution network. This paper presents the development of a high-frequency power distribution model for the simulation of simultaneous switching noise of a complementary metal-oxide-semiconductor (CMOS) chip on a multilayered ceramic substrate. Measurements are performed on a CMOS chip with simultaneously switching off-chip drivers (OCD's). The modeling approach is validated by the excellent agreement between the measurement waveforms and simulation results.

References

6