G. Katopis - Concepedia

Author

G. Katopis

IBM (United States)

Also Known As

G. A. Katopis, G. Katopis, G.A. Katopis, George A. Katopis, George Katopis, Katopis, G.

Publications

1.5K

Citations

H-Index

Concepts

All Affiliations

IBM (United States)Poughkeepsie Public Library District IBM Research - Thomas J. Watson Research Center IBM (Germany)Polytechnic University of Turin

About

G. Katopis is an author at IBM (United States) specializing in engineering, electrical engineering, and computer engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	29	1.3K
2	Electrical Engineering	17	28	1.3K
3	Computer Engineering	16	28	1.2K
4	Computer Science	2	2	27
5	Applied Physics	1	1	22

G. Katopis

Publications

1.3K

Citations

H-Index

Page 1

	Year	Citations
When are transmission-line effects important for on-chip interconnections? A. Deutsch, G.V. Kopcsay, P.J. Restle, IEEE Transactions on Microwave Theory and Techniques Short LinesElectrical EngineeringEngineeringVlsi DesignOn-chip Interconnections	1997	382
Delta-I noise specification for a high-performance computing machine G. Katopis Proceedings of the IEEE Electrical EngineeringEngineeringVlsi DesignCircuit DesignHigh-performance Architecture	1985	193
Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems Dale Becker, J.P. Eckhardt, R. Frech, IEEE Transactions on Components Packaging and Manufacturing Technology Part B EngineeringVlsi DesignComputer ArchitectureMid-frequency NoisePower Electronics	1998	87
Decoupling capacitor effects on switching noise R. Downing, P. Gebler, G. Katopis IEEE Transactions on Components Hybrids and Manufacturing Technology Low-power ElectronicsElectrical EngineeringEngineeringNoise ControlEffective Inductance	1993	72
When are transmission-line effects important for on-chip interconnections A. Deutsch, G.V. Kopcsay, P.J. Restle, Short LinesElectrical EngineeringPhysical Design (Electronics)EngineeringOn-chip Interconnections	2002	69
Extraction of /spl epsiv//sub r/(f) and tan/spl delta/(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique A. Deutsch, T.-M. Winkel, G.V. Kopcsay, IEEE Transactions on Advanced Packaging Electrical EngineeringEngineeringHigh-frequency DeviceDielectric Loss TandeltaMicrowave Transmission	2005	60
Frequency-dependent crosstalk simulation for on-chip interconnections A. Deutsch, H.H. Smith, C.W. Surovic, IEEE Transactions on Advanced Packaging EngineeringComputer ArchitectureInterconnection Network ArchitectureInterconnect (Integrated Circuits)Crosstalk Simulation Issues	1999	43
The importance of inductance and inductive coupling for on-chip wiring A. Deutsch, H. Smith, G. Katopis, Electrical Performance of Electronic Packaging Electrical EngineeringInductive CouplingEngineeringAdvanced Packaging (Semiconductors)Physical Design (Electronics)	2002	39
MCM technology and design for the S/390 G5 system G. Katopis, Dale Becker, T. R. Mazzawy, IBM Journal of Research and Development EngineeringVlsi DesignMultichip ModuleComputer ArchitectureIntegrated Circuits	1999	30
Design guidelines for short, medium, and long on-chip interconnections A. Deutsch, Dale Becker, G. Katopis, Electrical Performance of Electronic Packaging Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)MicrofabricationComputer Architecture	2002	25

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