Resistance changes due to Cu transport and precipitation during electromigration in submicrometric Al-0.5% Cu lines

Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation

Chunhua Hu, M. B. Small, Paul S. Ho · Journal of Applied Physics · 1993 · 155 citations

Aluminium Nitride, Engineering, Damage Formation Process +20

Interpretation of Resistance Changes during Interconnect Reliability Testing

John E. Sanchez, Van Pham · MRS Proceedings · 1994 · 24 citations

Reliability, Electrical Engineering, Reliability Engineering +10

The Influence of Thermal-Mechanical Effectson Resistance Changes During and After Electromigration Experiments

A. Scorzoni, Ilaria De Munari, H. Stulens et al. · MRS Proceedings · 1995 · 15 citations

Electromigration Technique, Engineering, Specific Resistance +11

Microstructural Mechanism of Electromigration Failure In Narrow Interconnects

Choongun Kim, S. I. Selister, J. W. Morris · MRS Proceedings · 1993 · 10 citations

Electrical Engineering, Electromigration Technique, Engineering +8