Microstructural Mechanism of Electromigration Failure In Narrow Interconnects

Electromigration in thin aluminum films on titanium nitride

I. A. Blech · Journal of Applied Physics · 1976 · 1.2K citations

Engineering, Materials Engineering, Materials Science +17

Grain size dependence of electromigration-induced failures in narrow interconnects

J. Cho, Carl V. Thompson · Applied Physics Letters · 1989 · 206 citations

Engineering, Electrical Engineering, Materials Science +17

Fatal electromigration voids in narrow aluminum-copper interconnect

J. H. Rose · Applied Physics Letters · 1992 · 94 citations

Natural Sciences, Electrical Engineering, Materials Science +14

Electromigration in a single crystalline submicron width aluminum interconnection

Shoso Shingubara, Yasushi Nakasaki, Hisashi Kaneko · Applied Physics Letters · 1991 · 90 citations

Engineering, Materials Engineering, Materials Science +17

Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnects

John E. Sanchez, Oliver Kraft, Eduard Arzt · Applied Physics Letters · 1992 · 63 citations

Natural Sciences, Materials Engineering, Materials Science +14