IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · 26 citations · 4 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesThin FilmsIntegrated Circuit DesignInterconnect ArchitectureInterconnect DesignInterconnect TechnologyNetwork-on-chip DesignThin Film Electrical PropertiesHigh-density InterconnectsInterconnect FabricationInterconnect Layout OptimizationInterconnect OptimizationInterconnect Resistance ReductionWire Sizing
The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Microelectronics Packaging Handbook
Rao Tummala, Eugene J. Rymaszewski, Y. C. Lee · Journal of Electronic Packaging · 1989 · 535 citations
Electrical properties of a multilayer thin film substrate for multichip packages
O. Shimada, Kenji Ito, T. Miyagi et al. · 2003 · 22 citations