IEEE Electron Device Letters · 1981 · 57 citations · 0 references
EngineeringElectrical EngineeringMaterials ScienceCircuit TheoryMetallic MaterialsMicroelectronicsCoupled CircuitsDevice SimulationElectric CircuitsInterconnect DesignInterconnect TechnologyTransmission LinesCoupling CoefficientInterconnect Capacitance ModelingInterconnect ModelingInterconnect ParasiticsParasitic CouplingThin Wire Modeling
This letter reports some interesting results on the two-dimensional effects of the capacitances of LSI metallic interconnect wires, based on a numerical analysis of the Laplace's equation. Our findings show that there exists an optimum condition for the relation between line-and-space and coupling capacitances.