IEEE Electron Device Letters · 2002 · 36 citations · 14 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesVlsi DesignDopingIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsStrain EngineeringThin-film TransistorsWide Band Gap SemiconductorsChannel Doping EffectsGate Oxide Thickness EffectsGate-dependent Current-voltage BehaviorSchottky Barrier CharacteristicsSchottky Barrier ContactsSchottky Barrier DiodesSchottky Barrier Height EngineeringSchottky Barriers
We propose new SiGe channel p-MOSFETs with germano-silicide Schottky source/drains (S/Ds). The Schottky barrier-height (SBH) for SiGe is expected to be low enough to improve the injection of carriers into the SiGe channel and, as a result, current drivability is also expected to improve. We demonstrate the proposed Schottky S/D p-MOSFETs down to a 50-nm gate-length. The drain current and transconductance are -339 μA/μm and 285 μS/μm at V/sub GS/=V/sub DS/=-1.5 V, respectively. By increasing the Ge content in the SiGe channel from 30% to 35%, the drive current. and transconductance can be improved up to 23% and 18%, respectively. This is partly due to the lower barrier-height for strained Si/sub 0.65/Ge/sub 0.35/ channel than those for strained Si/sub 0.7/Ge/sub 0.3/ channel device and partly due to the lower effective mass of the holes.
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Enhancement-mode quantum-well Ge/sub x/Si/sub 1-x /PMOS
Deepak Kumar Nayak, J.C.S. Woo, J.S. Park et al. · IEEE Electron Device Letters · 1991 · 191 citations
W. Saitoh, Atsushi Itoh Atsushi Itoh, Shigeharu Yamagami et al. · Japanese Journal of Applied Physics · 1999 · 88 citations