Concepedia

Passive and heterogeneous integration towards a Si-based System-in-Package concept

F. Roozeboom, A.L.A.M. Kemmeren, J.F.C. Verhoeven, F.C. van den Heuvel, J.H. Klootwijk, H. Kretschman, T. Frič, E.C.E. van Grunsven, Serge Bardy, Catherine Bunel,

Thin Solid Films · 2005 · 58 citations · 2 references

Concepts

EngineeringComputer EngineeringSystems EngineeringComputer ArchitectureSystem-on-chip DesignSystems ArchitectureChip PackagingIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationIntegration ArchitectureSystems IntegrationHeterogeneous IntegrationIntegrated Passive ComponentsSystem-in-packageSystem-in-package IntegrationThrough-silicon Via Packaging

References

2

High-Q integrated RF passives and RF-MEMS on silicon

Joost T.M. van Beek, M. H. W. M. van Delden, A. van Dijken et al. · MRS Proceedings · 2003 · 21 citations

Engineering, Electrical Engineering, Materials Science +12

High-Density, Low-loss MOS Decoupling Capacitors integrated in a GSM Power Amplifier

F. Roozeboom, A.L.A.M. Kemmeren, J. F. C. M. Verhoeven et al. · MRS Proceedings · 2003 · 15 citations

Engineering, Electrical Engineering, Analog Electronics +13