A.L.A.M. Kemmeren

Passive and heterogeneous integration towards a Si-based System-in-Package concept

F. Roozeboom, A.L.A.M. Kemmeren, J.F.C. Verhoeven et al. · Thin Solid Films · 2005 · 58 citations

Engineering, Computer Engineering, Systems Engineering +14

Elimination of accumulation charge effects for high-resistive silicon substrates

A.B.M. Jansman, J.T.M. van Beek, M. H. W. M. van Delden et al. · 2004 · 35 citations

Engineering, Electrical Engineering, Materials Science +17

Plasma-assisted atomic layer deposition of TiN monitored by <i>in situ</i> spectroscopic ellipsometry

S. B. S. Heil, E. Langereis, A.L.A.M. Kemmeren et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2005 · 34 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

High-density, low-loss MOS capacitors for integrated RF decoupling

F. Roozeboom, R. Elfrink, T.G.S.M. Rijks et al. · ˜The œInternational journal of microcircuits and electronic packaging · 2001 · 31 citations

Engineering, Electrical Engineering, Microelectronics +16

High-Q integrated RF passives and RF-MEMS on silicon

Joost T.M. van Beek, M. H. W. M. van Delden, A. van Dijken et al. · MRS Proceedings · 2003 · 21 citations

Engineering, Electrical Engineering, Materials Science +12