2002 · 11 citations · 3 references
EngineeringComputer EngineeringElectrical EngineeringComputer ArchitectureMicroelectronicsSystem-on-chip DesignChip PackagingIntegrated Circuit DesignMicroarchitecture DesignPhysical DesignProcessor Core DesignProcessor MicroarchitectureAdvanced PackagingElectrical Interconnect DesignHigh-density InterconnectsHigh-power-density DesignMultichip ModulesPackage CharacterizationProcessor Systems
This paper describes a state-of-the-art seven chip MCM-D/C package currently under production for use as a processor module for the high end of IBM's AS/400 Advanced Series with PowerPC technology. Physical design, process, and electrical design (characterization) is described, and trade-offs made between them are discussed.
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