Concepedia

Electrical Interconnect Design

Electrical Interconnect Design is the systematic methodology within battery pack design and MEMS packaging that defines the configuration, materials, and geometric layout of conductive pathways to enable reliable electrical signal and power transmission between discrete components while minimizing resistance, thermal stress, and mechanical failure under operational conditions.

147

Publications

7.6K

Citations

610

Authors

163

Institutions

Publications per year

2017–2026

17

Parents

Publications

147

Stretchable batteries with self-similar serpentine interconnects and integrated wireless recharging systems

Sheng Xu, Yihui Zhang, Jiung Cho et al. · Nature Communications · 2013 · 1.4K citations · Full text

, , +16

CACTI 6.0: A Tool to Model Large Caches

Naveen Muralimanohar, Rajeev Balasubramonian, Norman P. Jouppi · 2009 · 854 citations

, , +17

Optimizing NUCA Organizations and Wiring Alternatives for Large Caches with CACTI 6.0

2007 · 490 citations

, , +17

Stability, Causality, and Passivity in Electrical Interconnect Models

Piero Triverio, S. Grivet‐Talocia, M. Nakhla et al. · IEEE Transactions on Advanced Packaging · 2007 · 301 citations · Full text

, , +14

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er‐Ping Li, Xing‐Chang Wei, A.C. Cangellaris et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 206 citations

, , +17

1–5 of 147

Authors

610

  1. EG
    Eby G. Friedman

    University of Rochester, United States

    5 publications · 215 citations

    5

    h-index

  2. MS
    Madhavan Swaminathan

    Georgia Institute of Technology, United States

    4 publications · 96 citations

    4

    h-index

  3. PP
    Pamela Patterson

    University of California, Los Angeles, United States

    3 publications · 172 citations

    3

    h-index

  4. YH
    Yonggang Huang

    Northwestern University, United States

    4 publications · 1.6K citations

    3

    h-index

  5. YS
    Yewang Su

    Northwestern University, United States

    3 publications · 1.5K citations

    3

    h-index

1–5 of 610

Institutions

163

  1. University of California, Los Angeles

    Los Angeles, United States

    12 h-index

    30 publications

    2.3K citations

  2. Georgia Institute of Technology

    Atlanta, United States

    12 h-index

    53 publications

    1.2K citations

  3. Intel (United States)

    Santa Clara, United States

    6 h-index

    25 publications

    419 citations

  4. University of Illinois Urbana-Champaign

    Urbana, United States

    5 h-index

    25 publications

    25.6K citations

  5. University of Utah

    Salt Lake City, United States

    5 h-index

    8 publications

    1.1K citations

  6. University of Rochester

    Rochester, United States

    5 h-index

    18 publications

    778 citations

  7. Hewlett-Packard (United States)

    Palo Alto, United States

    4 h-index

    9 publications

    670 citations

  8. IBM (United States)

    Armonk, United States

    4 h-index

    17 publications

    600 citations

1–8 of 163

Venues

  1. 5

    h-index

  2. IEEE Transactions on Electron Devices

    4 publications · 148 citations

    4

    h-index

  3. IEEE Transactions on Advanced Packaging

    3 publications · 337 citations

    3

    h-index

  4. Journal of Power Sources

    3 publications · 155 citations

    3

    h-index

  5. 3

    h-index

1–5