Publication | Closed Access
Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies
40
Citations
6
References
2008
Year
Unknown Venue
EngineeringIc Packaging TechnologiesMechanical EngineeringComputer-aided DesignWafer Scale ProcessingAdvanced Packaging (Semiconductors)Thermal ResistanceThermal AnalysisThermal ModelingElectronic PackagingIntegration ApproachesMaterials Science3D Ic ArchitectureChip AttachmentMiniaturisation 3DHeat TransferMicroelectronics3D PrintingChip-scale PackageMicrofabricationThermal Engineering3D Integration
The miniaturisation 3D integration/stacking systems has a significant impact on both thermal resistance and thermo-mechanical reliability. The trends regarding these issues are summarised for the different 3D integration approaches: 3D-SIP, 3D-WLP and 3D-SIC.
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