IEEE Electron Device Letters · 2015 · 115 citations · 16 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsIii-v SemiconductorsMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor InterfacesWide-bandgap SemiconductorsBreakdown VoltageGallium Nitride (Gan) MaterialsHeterojunction InterfacesHigh-electron-mobility Transistors
A low on-resistance normally-off GaN double-channel metal–oxide–semiconductor high-electron-mobility transistor (DC-MOS-HEMT) is proposed and demonstrated in this letter, which features a 1.5-nm AlN insertion layer (ISL) located 6 nm below the conventional barrier/GaN interface, forming a second channel at the interface between the AlN-ISL and the underlying GaN. With gate recess terminated at the upper channel, normally-off operation was obtained with <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\mathrm {th}}$ </tex-math></inline-formula> of +0.5 V at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$I_{\mathrm {DS}}= 10 ~\mu \text{A}$ </tex-math></inline-formula> /mm or +1.4 V from the linear extrapolation of the transfer curve. The lower heterojunction channel is separated from the etched surface in the gate region, thereby maintaining its high field-effect mobility with a peak value of 1801 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text{V}\cdot \text{s}$ </tex-math></inline-formula> ). The on-resistance is as small as 6.9 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\Omega \cdot \text {mm}$ </tex-math></inline-formula> for a DC-MOS-HEMT with <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$L_{G}/L_{\mathrm {GS}}/L_{\mathrm {GD}} = 1.5/2/15~\mu \text{m}$ </tex-math></inline-formula> , and the maximum drain current is 836 mA/mm. A high breakdown voltage (>700 V) and a steep subthreshold swing of 72 mV/decade are also obtained.
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Enhancement mode AlGaN/GaN HFET with selectivelygrown <i>pn</i> junction gate
X. Hu, G. Simin, J. Yang et al. · Electronics Letters · 2000 · 188 citations
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AlGaN-GaN Double-Channel HEMTs
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