2009 · 176 citations · 59 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsNanotechnologySystem-on-chip DesignIntegrated Circuit DesignInterconnect ArchitectureInterconnect DesignInterconnect FabricsInterconnect TechnologyNetwork-on-chip DesignInterconnect OptimizationNetwork-on-chip ArchitecturesNetwork-on-chip IntegrationOn-chip CommunicationOn-chip InterconnectsThree-dimensional Integrated Circuit InterconnectsThree-dimensional IntegrationWireless Network-on-chip
Communication is critical for multi‑core SoC performance, and Networks‑on‑Chip have been proposed to simplify design, yet growing demands for energy‑efficiency and speed require new interconnect paradigms beyond traditional planar metal/dielectric structures. This work surveys the opportunities and challenges of three emerging interconnect paradigms—3‑D integration, nanophotonics, and wireless interconnects. The authors outline the opportunities and challenges of these paradigms, providing a comparative analysis of their technical prospects and obstacles.
Communication plays a crucial role in the design and performance of multi-core systems-on-chip (SoCs). Networks-on-chip (NoCs) have been proposed as a promising solution to simplify and optimize SoC design. However, it is expected that improving traditional communication technologies and interconnect organizations will not be sufficient to satisfy the demand for energy-efficient and high-performance interconnect fabrics, which continues to grow with each new process generation. Multiple options have been envisioned as compelling alternatives to the existing planar metal/dielectric communication structures. In this paper we outline the opportunities and challenges associated with three emerging interconnect paradigms: three-dimensional (3-D) integration, nanophotonic communication, and wireless interconnects.
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