Proceedings., 39th Electronic Components Conference · 1989 · 19 citations · 6 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsPolymer ChemistrySemiconductor DevicesChip PackagingGelsHydrogelsPackaging EngineeringPackaging MaterialsPlastic PackagingCeramic PackagingDevice EncapsulationHermetic PackagingMultichip ModulesPhysical PropertiesSilicon Device MaterialsSilicone Hydrogel MaterialsVlsi Implementation
High-performance silicone gel has been shown to possess excellent electrical and physical properties for VLSI packaging. With their intrinsic low modulus and soft gel-like nature, silicone gels have become very effective encapsulants for larger, high-I/O, wire-bonded VLSI chips. Recent studies indicate that adequate IC chip surface protection with high-performance silicon gels in plastic packaging could possibly replace conventional ceramic hermetic packaging. Some potential IC encapsulants are reviewed, focusing on the silicone gel, its chemistry, and its use as a VLSI device encapsulant for single- and multichip application. Testing of the gel is discussed, and temperature-humidity-bias test results are reported. Military applications of the gel are considered.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Encapsulation of integrated circuits
M.L. White · Proceedings of the IEEE · 1969 · 78 citations
Natural Sciences, Materials Engineering, Materials Science +17
High Performance Silicone Gel as IC Device Chip Protection
C.P. Wong · MRS Proceedings · 1987 · 24 citations