J.M. Segelken

Multichip Packaging Design for VLSI-Based Systems

Charles Bartlett, J.M. Segelken, N. Teneketges · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1987 · 90 citations

Engineering, Computer Engineering, Electrical Engineering +17

Internal thermal resistance of a multi-chip packaging design for VLSI based systems

Y.C. Lee, Hossein Ghaffari, J.M. Segelken · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 45 citations

Engineering, Computer Engineering, Electrical Engineering +17

Understanding the use of silicone gels for nonhermetic plastic packaging

C.P. Wong, J.M. Segelken, J.W. Balde · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 37 citations

Engineering, Materials Engineering, Materials Science +17

Mechanical Behavior of Flip-Chip Encapsulants

E. Suhir, J.M. Segelken · Journal of Electronic Packaging · 1990 · 29 citations

Engineering, Materials Engineering, Materials Science +15

Ultra-Dense: an MCM-based 3-D digital signal processor

J.M. Segelken, Laiping Wu, M.Y. Lau et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 24 citations

Engineering, Computer Engineering, Electrical Engineering +17