Y.C. Lee

Internal thermal resistance of a multi-chip packaging design for VLSI based systems

Y.C. Lee, Hossein Ghaffari, J.M. Segelken · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 45 citations

Engineering, Computer Engineering, Electrical Engineering +17

Mixed refrigerants for a glass capillary micro cryogenic cooler

M.-H. Lin, Peter E. Bradley, Marcia L. Huber et al. · Cryogenics · 2010 · 39 citations

Engineering, Materials Science, Mechanical Engineering +14

MEMS designed for tunable capacitors

H.D. Wu, Kevin Harsh, R. S. Irwin et al. · 2002 · 34 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Design, fabrication, and assembly of a hollow-core fiber-based micro cryogenic cooler

M.-H. Lin, Peter E. Bradley, Huihui Wu et al. · TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference · 2009 · 13 citations

Engineering, Materials Engineering, Materials Science +16

Thermal Enhancement of Stacked Dies Using Thermal Vias

Baekyoung Sung, Krishnateja Chepuri, Y.C. Lee et al. · 2006 · 10 citations

Engineering, Computer Engineering, Electrical Engineering +16