2002 · 32 citations · 3 references
EngineeringElectrical EngineeringMaterials ScienceMechanical Behavior Of MaterialsMicroelectronicsStructural MaterialsDevice ReliabilityFailure AnalysisFailure TheoriesFracture MechanicsReliabilityReliability ModelingBimodal DistributionElectrical ReliabilityElectromigrationElectromigration AnalysisElectromigration ReliabilityFailure MechanismsFailure ModelsLog-normal Model
The correct model for the electromigration failure distribution is a key issue in reliability methodology. Usually, the failure times of a sample are fitted by a single log-normal distribution. However, in some cases relevant deviations can be found. In this paper two types of non-log-normal distributions observed on via-line structures are discussed. They can be modeled by two types of bimodal distributions, each composed of two log-normal distributions. Both models consider different failure mechanisms within the sample or specimen. Experimental data sets coinciding with either model will be presented. The physical failure analysis confirms the model assumptions and supports the bimodal distribution concept.
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Electromigration and mechanical stress
J. R. Lloyd · Microelectronic Engineering · 1999 · 64 citations
Natural Sciences, Electrical Engineering, Materials Science +11
Effect of VLSI interconnect layout on electromigration performance
E.M. Atakov, T. S. Sriram, D. Dunnell et al. · 1998 · 26 citations