T. S. Sriram

Soft error considerations for deep-submicron CMOS circuit applications

N. Cohen, T. S. Sriram, N. Leland et al. · 2003 · 84 citations

Hardware Security, Electrical Engineering, Engineering +12

Thermal and ablative properties of rocket insulator compound based on EPDM

A.S. Deuri, Anil K. Bhowmick, Ratna Ghosh et al. · Polymer Degradation and Stability · 1988 · 64 citations

Materials Engineering, Materials Science, Electrical Engineering +10

Structure‐property relationship of HTPB‐based propellants. I. Effect of hydroxyl value of HTPB resin

R. Manjari, V. C. Joseph, L. P. Pandureng et al. · Journal of Applied Polymer Science · 1993 · 59 citations

Engineering, Chemistry, Htpb Resins +18

Structure‐property relationship of HTPB‐based propellants. II. Formulation tailoring for better mechanical properties

R. Manjari, U. I. Somasundaran, V. C. Joseph et al. · Journal of Applied Polymer Science · 1993 · 47 citations

Engineering, Mechanical Engineering, Molecular Weights +19

Effect of VLSI interconnect layout on electromigration performance

E.M. Atakov, T. S. Sriram, D. Dunnell et al. · 1998 · 26 citations

Engineering, Computer Architecture, Failure Statistics +19