A. von Glasow

Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes

G. Steinlesberger, M. Engelhardt, G. Schindler et al. · Microelectronic Engineering · 2002 · 81 citations

Electrical Engineering, Electromigration Technique, Engineering +9

Investigation of via-dominated multi-modal electromigration failure distributions in dual damascene Cu interconnects with a discussion of the statistical implications

J. Gill, T. Sullivan, S. Yankee et al. · 2003 · 41 citations

Dual Damascene Cu, Engineering, Chip Failure +19

Electromigration failure mechanism studies on copper interconnects

A. Fischer, A. von Glasow, S. Penka et al. · 2003 · 34 citations

Engineering, Interconnect (Integrated Circuits), Local Microstructural Properties +18

Experimental data and statistical models for bimodal EM failures

A. Fischer, Andreas Abel, Markus Lepper et al. · 2002 · 32 citations

Engineering, Mechanical Engineering, Electromagnetic Compatibility +16

The influence of the SiN cap process on the electromigration and stressvoiding performance of dual damascene Cu interconnects

A. von Glasow, A. Fischer, D. Bunel et al. · 2003 · 27 citations

Crystal Structure, Engineering, Chemical Deposition +22