Concepedia

S. Yankee

SY

2

Publications

51

Citations

2

H-Index

2002

Active since

Affiliations

IBM (United States)(Current)

S. Yankee is an author at IBM (United States) specializing in electronic packaging, applied physics, and engineering.

Top concepts

EngineeringApplied PhysicsMicroelectronicsElectronic PackagingElectrical Engineering3D PrintingMicrostructureNanoelectronicsMaterial ScienceMicrofabrication

Publications per year

2002–2003

2

Publications

2

Investigation of via-dominated multi-modal electromigration failure distributions in dual damascene Cu interconnects with a discussion of the statistical implications

J. Gill, T. Sullivan, S. Yankee et al. · 2003 · 41 citations

Dual Damascene Cu, Engineering, Chip Failure +19

Area array solder interconnection technology for the three-dimensional silicon cube

Wayne J. Howell, D.W. Brouillette, J.W. Konejwa et al. · 2002 · 10 citations

Engineering, Device Integration, Solder-bump Interconnection Challenges +16

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