Applied Physics Letters · 1981 · 73 citations · 9 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsEpitaxial GrowthHigh-frequency Semiconductor DevicesIntegrated OpticsMicrowave Semiconductor DevicesSemiconductor Crystal GrowthSemiconductor Device MaterialsEpitaxial Film GrowthEpitaxial MaterialsEpitaxial Thin FilmsEpitaxial Wafer PreparationGaas Microwave Integrated CircuitsMicrowave DevicesMolecular Beam EpitaxySemiconductor Materials For Microwave Devices
Integrated optics and integrated microwave circuits require extremely uniform epitaxial layer thicknesses, composition profiles, and doping profiles. With a sample rotating mechanism, molecular beam epitaxy can for the first time prepare GaAs and AlxGa1−xAs layers with thickness variation of less than 1% over a lateral dimension of 5 cm. The variation of AlAs mole fraction of the Al0.3Ga0.7As over a 10-cm2 area was less than 0.4%. The variation of the ’’pinch-off’’ voltage for a field effect transistor structure was less than 1.4% over a 10-cm2 wafer. These results represent the most uniform epitaxial layers ever prepared with any crystal growth technology.
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Ballistic electron motion in GaAs at room temperature
L.F. Eastman, R. A. Stall, D. W. Woodard et al. · Electronics Letters · 1980 · 62 citations