Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints - Concepedia

Concepedia

Publication | Closed Access

Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

82

Citations

20

References

2013

Year

Rui Zhang, Yanhong Tian, Chunjin Hang, Baolei Liu, Chunqing Wang

Materials Letters

Materials ScienceMaterials EngineeringEngineeringCu3sn GrainsMetallurgical InteractionFormation MechanismChemistryAlloy PhaseMetallurgical SystemMicrostructure

References

	Year	Citations

Page 1