Chunjin Hang

Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

Rui Zhang, Yanhong Tian, Chunjin Hang et al. · Materials Letters · 2013 · 82 citations

Materials Science, Materials Engineering, Engineering +7

Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads

Yanhong Tian, Rui Zhang, Chunjin Hang et al. · Materials Characterization · 2013 · 74 citations

Materials Science, Materials Engineering, Sn3.0ag0.5cu Solder Joints +9

Microstructural evolution and degradation mechanism of SiC–Cu chip attachment using sintered nano-Ag paste during high-temperature ageing

Fan Yang, Wenbo Zhu, Weizhen Wu et al. · Journal of Alloys and Compounds · 2020 · 65 citations

Materials Science, Engineering, Applied Physics +8

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

Chunjin Hang, Yanhong Tian, Rui Zhang et al. · Journal of Materials Science Materials in Electronics · 2013 · 63 citations

Materials Science, Materials Engineering, Engineering +7

Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films

He Zhang, Shang Wang, Yanhong Tian et al. · Chemical Engineering Journal · 2020 · 60 citations

Materials Science, Engineering, Nanomaterials +6