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A 3 kV Schottky barrier diode in 4H-SiC
76
Citations
5
References
1998
Year
SemiconductorsMetal OverlapElectrical EngineeringElectronic DevicesEngineeringSemiconductor TechnologyHigh Voltage EngineeringPower DeviceApplied PhysicsPower Semiconductor DeviceLow Reverse LeakageSemiconductor Device FabricationElectric FieldThin FilmsPower ElectronicsPower SemiconductorsCarbideSemiconductor Device
High-voltage Schottky barrier diodes with low reverse leakage current were processed on hot-wall chemical vapor deposition grown 4H-SiC films. A metal overlap onto the oxide layer was employed to reduce electric field crowding at the contact periphery. By utilizing a 42–47 μm thick, high-quality epitaxial layers with doping in the range of 7×1014–2×1015 cm−3, a record blocking voltage of above 3 kV was achieved. The large diodes with 1.0 mm diameter showed breakdown at 2.1 kV. The reverse leakage current density at 1.0 kV was measured to be 7.0×10−7 A cm−2. Specific on-resistance of the diode with breakdown voltage at 3 kV was 34 mΩ cm2.
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