Thermal resistance measurement protocols

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. Bittle, Jeffrey C. Suhling, R.E. Beaty et al. · Journal of Electronic Packaging · 1991 · 201 citations

Engineering, Electrical Engineering, Materials Science +17

Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment

H.I. Rosten, John Parry, Clemens Lasance et al. · 2002 · 38 citations

Engineering, Electrical Engineering, Systems Engineering +17

Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models

H. Vinke, Clemens Lasance · 2002 · 24 citations

Engineering, Electrical Engineering, Heat Transfer +15

Development and analysis of an automated test system for the thermal characterization of IC packaging technologies

S. Cian Ó Mathúna · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 15 citations

Engineering, Mechanical Engineering, Heat Transfer +16