Japanese Journal of Applied Physics · 1995 · 24 citations · 8 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsChemical Vapor DepositionDevice CharacterizationEpitaxial GrowthSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor Thin FilmsDefect DensityEpitaxial MaterialsLow-pressure Chemical Vapor DepositionQuadrupole Mass AnalyzersQuadrupole Mass SpectrometryReflection High-energy Electron DiffractionSilicon DioxideSilicon-on-insulator Technology
Growth and properties of a double SOI (Si-on-insulator) structure, which consists of epitaxial Al 2 O 3 as an insulator layer and epitaxial Si layers, are discussed. LP-CVD (low-pressure chemical vapor deposition) for γ- Al 2 O 3 (100) growth on Si(100) substrates was combined with Si CVD through a sample exchanging chamber with reflection high-energy electron diffraction (RHEED) and quadrupole mass spectrometer (QMS) to grow successively and analyzed without exposure to air. These epitaxial multilayers were characterized by RHEED, Auger electron spectroscopy (AES), cross-sectional transmissin electron microscopy (TEM) and etching method. Metal-oxide-semiconductor (MOS) field effect transistor (FET) mobility was also studied on each Si layer. Both Si layers showed similar defect density and mobility. This double SOI structure was applied to fabrication of a pressure sensor for use at elevated temperatures up to 300° C.
8
Heteroepitaxial Si/Al2O3/Si structures
Mákoto Ishida, Kazuaki Sawada, S. Yamaguchi et al. · Applied Physics Letters · 1989 · 49 citations