Flexible polysilicon sensor array modules using “etch-release” packaging scheme

Experimental Stress Analysis

James W. Dally, W. F. Riley, A. S. Kobayashi · Journal of Applied Mechanics · 1978 · 1.2K citations · Full text

Engineering, Materials Engineering, Materials Science +17

A graphical representation of the piezoresistance coefficients in silicon

Yozo Kanda · IEEE Transactions on Electron Devices · 1982 · 897 citations

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P.J. French, A G R Evans · Solid-State Electronics · 1989 · 185 citations

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