Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

Yi-Wun Wang, Yan‐Cheng Lin, Chun-Te Tu et al. · Journal of Alloys and Compounds · 2008 · 195 citations

Natural Sciences, Materials Engineering, Materials Science +9

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

A.A. El-Daly, A.E. Hammad, A. Fawzy et al. · Materials & Design (1980-2015) · 2012 · 156 citations

Natural Sciences, Materials Engineering, Materials Science +16

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

A.A. El-Daly, A.E. Hammad · Materials & Design (1980-2015) · 2012 · 136 citations

Natural Sciences, Materials Engineering, Materials Science +13

Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

Jeong‐Won Yoon, Young‐Ho Lee, Dae‐Gon Kim et al. · Journal of Alloys and Compounds · 2004 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +9

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers

Tomi Laurila, Jenny Hurtig, Vesa Vuorinen et al. · Microelectronics Reliability · 2008 · 109 citations

Natural Sciences, Materials Engineering, Materials Science +12