Concepedia
Electrochimica Acta · 2007 · 165 citations · 40 references
Open access
EngineeringMaterials EngineeringMaterials ScienceSurface EngineeringSurface ScienceSurface ModificationAdsorbate CharacterizationBreakthrough CurvesBump BehaviorBump Steer ControlDamascene ProcessSurface Coverage Effects
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Damascene copper electroplating for chip interconnections
P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations
Engineering, Materials Engineering, Materials Science +16
The chemistry of additives in damascene copper plating
Philippe M. Vereecken, Robert A. Binstead, Hariklia Deligianni et al. · IBM Journal of Research and Development · 2005 · 450 citations
Natural Sciences, Materials Engineering, Materials Science +17
Superconformal Electrodeposition of Copper in 500–90 nm Features
Thomas P. Moffat, John E. Bonevich, William Huber et al. · Journal of The Electrochemical Society · 2000 · 403 citations
Superconformal film growth: Mechanism and quantification
T. P. Moffat, Daniel Wheeler, Monica D. Edelstein et al. · IBM Journal of Research and Development · 2005 · 371 citations
Natural Sciences, Chemical Engineering, Chemistry +17
Electrodeposition of Copper in the SPS-PEG-Cl Additive System
Thomas P. Moffat, Daniel Wheeler, D. Josell · Journal of The Electrochemical Society · 2004 · 356 citations
Natural Sciences, Chemistry, Materials Science +17