Concepedia

T. P. Moffat

TP

Statistics

Publications

8

Citations

961

H-Index

8

Active since

2001

Affiliations

National Institute of Standards and Technology(Current)

T. P. Moffat is an author at National Institute of Standards and Technology specializing in electrochemistry, engineering, and materials science.

Top concepts

EngineeringElectrochemistrySurface ScienceMaterial ScienceApplied PhysicsMaterials EngineeringChemical EngineeringElectrical EngineeringMicroelectronicsCorrosion

Publications per year

2001–2013

8

Publications

8

Superconformal film growth: Mechanism and quantification

T. P. Moffat, Daniel Wheeler, Monica D. Edelstein et al. · IBM Journal of Research and Development · 2005 · 370 citations

Materials Science, Materials Engineering, Superconformal Film Growth +15

Superconformal Electrodeposition in Submicron Features

D. Josell, Daniel Wheeler, William Huber et al. · Physical Review Letters · 2001 · 176 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

D. Josell, Daniel Wheeler, C. Witt et al. · Electrochemical and Solid-State Letters · 2003 · 153 citations

Materials Engineering, Materials Science, Chemical Engineering +13

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Daniel Wheeler, T. P. Moffat, D. Josell · Journal of The Electrochemical Society · 2013 · 71 citations · Full text

Engineering, Bottom Surface, Electrode-electrolyte Interface +17

Accelerator Aging Effects During Copper Electrodeposition

T. P. Moffat, A. B. Baker, Daniel Wheeler et al. · Electrochemical and Solid-State Letters · 2003 · 71 citations

Deposition Reaction, Electrical Engineering, Chemical Engineering +14

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