Applied Physics Letters · 2006 · 140 citations · 7 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsHigh-frequency Semiconductor DevicesPhotodetectorsPhotonic Integrated CircuitsSemiconductor DetectorsSemiconductor Device MaterialsSemiconductor PhysicsGermanium PhotodetectorsIntegrated PhotodetectorsIntegrated Photonic DevicesMolecular Beam EpitaxyP-i-n PhotodetectorsPhotodetector BandwidthSilicon PhotodetectorsSilicon Photodiodes
The authors present a germanium on silicon p-i-n photodiode for vertical light incidence. For a Ge p-i-n photodetector with a radius of 5μm a 3dB bandwidth of 25GHz is measured at an incident wavelength of 1.55μm and zero external bias. For a modest reverse bias of 2V, the 3dB bandwidth increases to 39GHz. The monolithically integrated devices are grown on Si with solid source molecular beam epitaxy. The complete detector structure consisting of a highly p-doped Ge buried layer, an intrinsic absorption region, and a highly n-doped top contact layer of Ge∕Si is grown in one continuous epitaxial run. A low growth temperature sequence was needed to obtain abrupt doping transitions between the highly doped regions surrounding the intrinsic layer. A theoretical consideration of the 3dB bandwidth of the Ge detector was used to optimize the layer structure. For a photodiode with 5μm mesa radius the maximum theoretical 3dB frequency is 62GHz with an intrinsic region thickness of 307nm.
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High-Speed Germanium-on-SOI Lateral PIN Photodiodes
G. Dehlinger, Steven J. Koester, J.D. Schaub et al. · IEEE Photonics Technology Letters · 2004 · 155 citations