Lifetime modelling for microsystems integration: from nano to systems

An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments

W. C. Oliver, George M. Pharr · Journal of materials research/Pratt's guide to venture capital sources · 1992 · 26.6K citations

Natural Sciences, Materials Engineering, Materials Science +16

Virtual crack closure technique: History, approach, and applications

Ronald Krueger · Applied Mechanics Reviews · 2004 · 1.5K citations

Engineering, Materials Engineering, Materials Science +17

Thermal Stress and Low Cycle Fatigue

S. S. Manson, Thomas J. Dolan · Journal of Applied Mechanics · 1966 · 727 citations · Full text

Natural Sciences, Materials Science, Physics +10

Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

Andreas Schubert, R. Dudek, E. Auerswald et al. · 2003 · 386 citations

Engineering, Materials Engineering, Materials Science +17

Interlayer cooling potential in vertically integrated packages

Thomas Brunschwiler, Bruno Michel, H. Rothuizen et al. · Microsystem Technologies · 2008 · 187 citations

Engineering, Materials Engineering, Mechanical Engineering +10