Concepedia
International Communications in Heat and Mass Transfer · 2001 · 16 citations · 2 references
EngineeringManufacturing EngineeringManufacturing ProcessesPackaging DesignChip PackagingInjection MoldingMold MakingPackage DesignPackaging EngineeringFlip-chip PackagingMold DesignMold Filling DynamicsMold Flow AnalysisPackage Deformation Resistance
2
Underfill of flip chip on laminates: simulation and validation
Luu Nguyen, C. Quentin, P. Fine et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 78 citations
Engineering, Computational Engineering, Materials Engineering +15
Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages
Aoyang Xu, H. F. Nied · Journal of Electronic Packaging · 2000 · 27 citations
Engineering, Materials Engineering, Materials Science +16