Impact of patterning and ashing on electrical properties and reliability of interconnects in a porous SiOCH ultra low-k dielectric material - Concepedia

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Impact of patterning and ashing on electrical properties and reliability of interconnects in a porous SiOCH ultra low-k dielectric material

DOI Full Paper Access

20

Citations

3

References

2005

Year

M. Aimadeddine, V. Arnal, A. Farcy, C. Guedj, T. Chevolleau, N. Possémé, M. Assous, O. Louveau, F. Volpi, Jose Luis Chavez Torres

Microelectronic Engineering

Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringApplied PhysicsTime-dependent Dielectric BreakdownPorosityElectronic PackagingSilicon On InsulatorMicroelectronicsElectrical PropertiesElectrical PropertyInterconnect (Integrated Circuits)Electrical Insulation

References

	Year	Citations

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