Modern IC packaging trends and their reliability implications

An Embedded Device Technology Based on a Molded Reconfigured Wafer

Markus Brunnbauer, E. Furgut, G. Beer et al. · 2006 · 175 citations

Engineering, Manufacturing Engineering, Materials Science +17

Drop Test Reliability Improvement of Lead-free Fine Pitch BGA Using Different Solder Ball Composition

C. Birzer, B Rakow, R. Steiner et al. · 2006 · 48 citations

Engineering, Electrical Engineering, Materials Engineering +17

Tin Whisker formation - results, test methods and countermeasures

Marc Dittes, P. Obemdorff, Luc Petit · 2004 · 46 citations

Engineering, Materials Engineering, Materials Science +16

Qualification of SnAg solder bumps for lead-free flip chip applications

B. Ebersberger, R. S. Bauer, L. Alexa · 2004 · 20 citations

Engineering, Materials Engineering, Materials Science +17

Reliability Investigations of Leadless QFN Packages until End-of-Life with Application Specific Board Level Stress Tests

C. Birzer, Stephan Stoeckl, G. Schuetz et al. · 2006 · 15 citations

Engineering, Materials Engineering, Materials Science +17