Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

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Copper interconnections and reliability

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Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

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Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

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Natural Sciences, Materials Engineering, Materials Science +16

Sn/Co solid/solid interfacial reactions

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Natural Sciences, Materials Science, Physics +12