Thermal stability of Cu/α-Ta/SiO2/Si structures

Diffusion of Metals in Silicon Dioxide

J. D. McBrayer, R.M. Swanson, T. W. Sigmon · Journal of The Electrochemical Society · 1986 · 528 citations

Natural Sciences, Materials Engineering, Materials Science +17

Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization

Alain E. Kaloyeros, Eric Eisenbraun · Annual Review of Materials Science · 2000 · 362 citations

Natural Sciences, Materials Engineering, Materials Science +17

Comparative study of tantalum and tantalum nitrides (Ta2N and TaN) as a diffusion barrier for Cu metallization

Kyung-Hoon Min, Kyu-Chang Chun, Ki‐Bum Kim · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 261 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electromigration in copper conductors

J. R. Lloyd, J. J. Clement · Thin Solid Films · 1995 · 234 citations

Engineering, Electrical Engineering, Materials Engineering +11

Diffusion barrier effects of transition metals for Cu/M/Si multilayers (M=Cr, Ti, Nb, Mo, Ta, W)

H. Ono, Tadashi Nakano, Tomohiro Ohta · Applied Physics Letters · 1994 · 205 citations

Natural Sciences, Materials Engineering, Materials Science +17