Characterization of TMAH based cleaning solution for post Cu-CMP application

Chemical processes in the chemical mechanical polishing of copper

Joseph M. Steigerwald, S. P. Murarka, R.J. Gutmann et al. · Materials Chemistry and Physics · 1995 · 197 citations

Engineering, Materials Engineering, Materials Science +14

Potential-pH Diagrams of Interest to Chemical Mechanical Planarization of Copper

Subramanian Tamilmani, Wayne Huang, Srini Raghavan et al. · Journal of The Electrochemical Society · 2002 · 130 citations

Natural Sciences, Chemical Engineering, Chemistry +15

Some aspects of copper corrosion in presence of benzotriazole and chloride ions

Snežana Milić, Milan M. Antonijević · Corrosion Science · 2008 · 124 citations

Natural Sciences, Materials Engineering, Materials Science +14

A study of the electrochemical formation of Cu(I)-BTA films on copper electrodes and the mechanism of copper corrosion inhibition in aqueous chloride/benzotriazole solutions

Alexander D. Modestov, G.-D. Zhou, Yun Wu et al. · Corrosion Science · 1994 · 94 citations

Natural Sciences, Chemistry, Materials Science +17

Copper Dissolution in Aqueous Ammonia-Containing Media during Chemical Mechanical Polishing

Qiuliang Luo, Raymond A. Mackay, S. V. Babu · Chemistry of Materials · 1997 · 94 citations

Natural Sciences, Chemistry, Materials Science +16