Concepedia
Statistics
Publications
11
Citations
344
H-Index
10
Active since
2006
Affiliations
Hanyang University(Current)
Indian Institute of Technology Madras
Northeastern University
SK Group (South Korea)
Y. Nagendra Prasad is an author at Hanyang University specializing in materials science, materials engineering, and engineering.
Publications per year
2006–2015
Characterization of TMAH based cleaning solution for post Cu-CMP application
R. Venkatesh, Tae-Young Kwon, Y. Nagendra Prasad et al. · Microelectronic Engineering · 2012 · 69 citations
Natural Sciences, Materials Engineering, Materials Science +8
Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor
Y. Nagendra Prasad · Electrochimica Acta · 2007 · 66 citations
Natural Sciences, Chemical Engineering, Chemistry +6
Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation
Y. Nagendra Prasad, Tae-Young Kwon, In‐Kwon Kim et al. · Journal of The Electrochemical Society · 2011 · 43 citations · Full text
Engineering, Materials Engineering, Materials Science +17
Analysis of Scratches Formed on Oxide Surface during Chemical Mechanical Planarization
Jae-Gon Choi, Y. Nagendra Prasad, In‐Kwon Kim et al. · Journal of The Electrochemical Society · 2009 · 31 citations
Engineering, Materials Engineering, Materials Science +15
Optimization of Process Parameters in Wire EDM of HCHCr Material Using Taguchi's Technique
G. Ugrasen, H.V. Ravindra, G. V. Naveen Prakash et al. · Materials Today Proceedings · 2015 · 28 citations
Engineering, Industrial Engineering, Manufacturing Engineering +15
1–5 of 11