Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor

Chemical mechanical planarization for microelectronics applications

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Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

Yair Ein‐Eli, David Starosvetsky · Electrochimica Acta · 2006 · 205 citations

Natural Sciences, Materials Engineering, Materials Science +17

Surface Chemistry Studies of Copper Chemical Mechanical Planarization

J. M. Hernandez, P. Wrschka, G. S. Oehrlein · Journal of The Electrochemical Society · 2001 · 189 citations

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Initial study on copper CMP slurry chemistries

Ronald A. Carpio, J. Farkas, Rahul Jairath · Thin Solid Films · 1995 · 142 citations

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The Role of Glycine in the Chemical Mechanical Planarization of Copper

Serdar Aksu, Fiona M. Doyle · Journal of The Electrochemical Society · 2002 · 131 citations

Natural Sciences, Chemistry, Materials Science +16