Concepedia

Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films

A. K. Sikder, Ashok Kumar, Pratik Shukla, Parshuram B. Zantye, M. Sanganaria

Journal of Electronic Materials · 2003 · 16 citations · 18 references

DOI

Concepts

References

18

A method for interpreting the data from depth-sensing indentation instruments

M. Doerner, William D. Nix · Journal of materials research/Pratt's guide to venture capital sources · 1986 · 2.8K citations

, , +5

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 359 citations

, , +17

Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature

C. Lingk, M. E. Gross · Journal of Applied Physics · 1998 · 205 citations

, , +16

Self-annealing characterization of electroplated copper films

Sébastien Lagrange, Sywert Brongersma, Moshe Judelewicz et al. · Microelectronic Engineering · 2000 · 168 citations

, , +13

Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films

Haebum Lee, S.S. Wong, S.D. Lopatin · Journal of Applied Physics · 2003 · 130 citations

, , +17