Moshe Judelewicz

Self-annealing characterization of electroplated copper films

Sébastien Lagrange, Sywert Brongersma, Moshe Judelewicz et al. · Microelectronic Engineering · 2000 · 163 citations

Materials Engineering, Materials Science, Electrical Engineering +6

High quality Si1−<i>x</i>−<i>y</i>Ge<i>x</i>C<i>y</i> epitaxial layers grown on (100) Si by rapid thermal chemical vapor deposition using methylsilane

Jing Mi, P. Warren, P. Letourneau et al. · Applied Physics Letters · 1995 · 80 citations

Semiconductors, Materials Science, Materials Engineering +10

SU-8 nanocomposite photoresist with low stress properties for microfabrication applications

S. Jiguet, Arnaud Bertsch, Moshe Judelewicz et al. · Microelectronic Engineering · 2006 · 64 citations · Full text

Materials Science, Su-8 Nanocomposite Photoresist, Engineering +8

Microstructural development during fatigue of copper foils 20–100 μm thick

Moshe Judelewicz, H.U. Künzi, N. Merk et al. · Materials Science and Engineering A · 1994 · 63 citations

Materials Science, Engineering, Mechanical Properties +7

Effect of filler behavior on nanocomposite SU8 photoresist for moving micro-parts

S. Jiguet, Moshe Judelewicz, Stefano Mischler et al. · Microelectronic Engineering · 2006 · 52 citations · Full text

Materials Science, Engineering, Nanomaterials +10