Journal of Electronic Materials · 2003 · 50 citations · 25 references
Natural SciencesMaterials EngineeringMaterials ScienceMetallic MaterialsMetallurgyThin FilmsAlloysMetal MaterialsMetalsThin Film AnnealingThin-film DepositionThin-film MaterialsAnnealing Temperature EffectsCopper AlloysCopper MetallizationCopper MetallurgyMetal Thin FilmsMetallizationThermal AnnealingThermal Annealing Effects
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Reaction Kinetics in Differential Thermal Analysis
H.E. Kissinger · Analytical Chemistry · 1957 · 13K citations
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Diffusion barrier properties of TiW between Si and Cu
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