Improved resistive switching phenomena and mechanism using Cu-Al alloy in a new Cu:AlOx/TaOx/TiN structure - Concepedia

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Improved resistive switching phenomena and mechanism using Cu-Al alloy in a new Cu:AlOx/TaOx/TiN structure

36

Citations

24

References

2015

Year

Sourav Roy, S. Maikap, Gopinathan Pillai Sreekanth, Mrinmoy Dutta, Debanjan Jana, Y.Y. Chen, Jer‐Ren Yang

Journal of Alloys and Compounds

Materials EngineeringMaterials ScienceAluminium NitrideEngineeringCu-al AlloyApplied PhysicsAlox/taox/tin StructureNew Cu

References

	Year	Citations

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