Concepedia

Oxidation of Au4Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175°C

C.D. Breach, F. Wulff

Microelectronics Reliability · 2006 · 20 citations · 14 references

DOI

Concepts

References

14

Chemical Kinetics of Solids

H. Schmalzried · Materials science forum · 1997 · 320 citations

, , +17

Intermetallic formation in gold-aluminum systems

Elliott Philofsky · Solid-State Electronics · 1970 · 224 citations

, , +13

Thin film compound phase formation sequence: An effective heat of formation model

R. Pretoriüs, T. Marais, C.C. Theron · Materials Science Reports · 1993 · 150 citations

, , +14

New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al

C.D. Breach, F. Wulff · Microelectronics Reliability · 2004 · 110 citations

, , +13

Wire-Bond Void Formation During High Temperature Aging

Hee‐Ra Chang, K. C. Hsieh, Theo Martens et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 43 citations

, , +17