Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation

<i>Grain Boundaries in Metals</i>

David McLean, A. A. Maradudin · Physics Today · 1958 · 1.9K citations

Materials Science, Engineering, Grain Boundaries +3

Grain boundaries in metals

Raymond L. Smith · Journal of the Franklin Institute · 1958 · 525 citations

Materials Science, Engineering, Grain Boundaries +5

Equilibrium segregation in a ternary solution: A model for temper embrittlement

M. Guttmann · Surface Science · 1975 · 519 citations

Materials Science, Ternary Solution, Engineering +12

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 435 citations

Engineering, Mechanical Engineering, Kirkendall Void Formation +16

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 270 citations

Materials Science, Materials Engineering, Friction Welding +5