Concepedia

Void Elimination

Void Elimination is a process-level mechanism in materials science that belongs to the class of interfacial defect mitigation techniques, specifically distinguished by its role in removing micro-voids at the faying surfaces during diffusion bonding through atomic diffusion and plastic deformation under applied pressure and elevated temperature.

64

Publications

2.4K

Citations

270

Authors

95

Institutions

Publications per year

2017–2026

15

Parents

Publications

64

Homogenization‐based topology optimization for high‐resolution manufacturable microstructures

Jeroen P. Groen, Ole Sigmund · International Journal for Numerical Methods in Engineering · 2017 · 342 citations · Full text

, , +15

Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints

Yu Jin, J.Y. Kim · Acta Materialia · 2008 · 167 citations

, , +15

Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

Doosoo Kim, Jong-hyeon Chang, Jungil Park et al. · Journal of Materials Science Materials in Electronics · 2011 · 117 citations

, , +12

Eliminate Kirkendall voids in solder reactions on nanotwinned copper

Tao-Chi Liu, Chien-Min Liu, Yi-Sa Huang et al. · Scripta Materialia · 2012 · 110 citations

, , +12

The extrusion-based additive manufacturing of moisture-cured silicone elastomer with minimal void for pneumatic actuators

Jeffrey Plott, Albert J. Shih · Additive manufacturing · 2017 · 92 citations

, , +17

1–5 of 64

Authors

270

  1. CC
    Chih‐Ming Chen

    National Chung Hsing University, Taiwan

    2 publications · 35 citations

    2

    h-index

  2. CR
    C. R. Kao

    National Taiwan University, Taiwan

    2 publications · 75 citations

    2

    h-index

  3. YY
    Yang Yang

    University of Central Florida, United States

    2 publications · 66 citations

    2

    h-index

  4. HL
    Hao Lü

    Shanghai Jiao Tong University, China

    2 publications · 66 citations

    2

    h-index

  5. CY
    Chun Yu

    Shanghai Jiao Tong University, China

    2 publications · 66 citations

    2

    h-index

1–5 of 270

Institutions

95

  1. Hitachi (Japan)

    Tokyo, Japan

    3 h-index

    26 publications

    809 citations

  2. National Taiwan University

    Taipei, Taiwan

    2 h-index

    9 publications

    338 citations

  3. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    2 h-index

    4 publications

    382 citations

  4. National Chung Hsing University

    Taichung, Taiwan

    2 h-index

    8 publications

    151 citations

  5. University of Stuttgart

    Stuttgart, Germany

    2 h-index

    3 publications

    53 citations

  6. Shanghai Jiao Tong University

    Shanghai, China

    2 h-index

    9 publications

    287 citations

  7. Czech Technical University in Prague

    Prague, Czechia

    1 h-index

    6 publications

    486 citations

  8. Guangdong Technion-Israel Institute of Technology

    Shantou, China

    1 h-index

    1 publications

    39 citations

1–8 of 95

Venues

  1. Microelectronics Reliability

    5 publications · 185 citations

    5

    h-index

  2. Journal of Materials Processing Technology

    3 publications · 167 citations

    3

    h-index

  3. Polymer Composites

    3 publications · 79 citations

    3

    h-index

  4. Scripta Materialia

    3 publications · 204 citations

    3

    h-index

  5. Materials Letters

    2 publications · 56 citations

    2

    h-index

1–5