2007 · 71 citations · 3 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsComplementary Metal-oxide-semiconductor TechnologyDevice ScalingIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationQuantum Well DevicesCircuit IntegrationEnhancement-mode TransistorsHeterogeneous Device IntegrationHeterogeneous IntegrationHigh-speed Cmos DesignHigh-speed Logic DesignIntegration Of Iii-v MaterialsSilicon
This paper describes for the first time, the heterogeneous integration of In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.7</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.3</sub> As quantum well device structure on Si substrate through a novel, thin composite metamorphic buffer architecture with the total composite buffer thickness successfully scaled down to 1.mum, resulting in high- performance short-channel enhancement-mode In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.7</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.3</sub> As QWFETs on Si substrate for future high-speed digital logic applications at low supply voltage such as 0.5 V.
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